ABSTRACT
Worldwide, huge research efforts are underway to extend the applications for both well-known thermo-
electric devices: Peltier coolers and thermoelectric generators (thermogenerators). In addition to
widespread activities in low dimensional structures,
significant progress is also expected in the
development of conventional thermoelectric materials, bismuthtelluride-related compounds (V-VI
materials), leadtelluride related compounds (IV-VI materials), and SiGe alloys. Summarizing current
development three focal points are the key drivers for the predicated emerging markets such as
telecommunication and chip cooling:
Enhancement of the thermoelectric figure-of-merit (FOM) ZT. The quality of the material in
practical applications is described by the thermoelectric FOM Z ¼ a
s=l,
Seebeck coefficient a
(V K
), electrical conductivity s (V
m
), and thermal conductivity l (Wm
K
). This
performance can be significantly enhanced to ZT .. 1 by employing nanostructured materials
such as quantum wells, superlattices, nanowires, and nanograins.
