ABSTRACT
Microelectromechanical systems (MEMS) refer to devices that have characteristic length of less than 1 mm but more than 1 micron, that combine electrical and mechanical components, and that are fabricated using integrated circuit batch-processing technologies. Current manufacturing techniques for MEMS include surface silicon micromachining; bulk silicon micromachining; lithography, electrodeposition, and plastic molding; and electrodischarge machining. The multidisciplinary field has witnessed explosive growth during the last decade, and the technology is progressing at a rate that far exceeds that of our understanding of the physics involved. Electrostatic, magnetic, electromagnetic, pneumatic and thermal actuators, motors, valves, gears, cantilevers, diaphragms, and tweezers of less than 100-micron size have been fabricated. These have been used as sensors for pressure, temperature, mass flow, velocity, sound, and chemical composition; as actuators for linear and angular motions; and as simple components for complex systems such as robots, micro-heat-engines, and micro-heat-pumps. Worldwide market projections for MEMS devices tend to be optimistic, reaching $30 billion by the year 2006
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