ABSTRACT
Packaging of electronic circuits is the science and the art of establishing interconnections and a suitable operating environment for predominantly electrical circuits. It supplies the chips with wires to distribute signals and power, remove the heat generated by the circuits, and provides them with physical support and environmental protection. It plays an important role in determining the performance, cost, and reliability of the system. With the decrease in feature size and increase in the scale of integration, the delay in on-chip circuitry is now smaller than that introduced by package. Thus, the ideal package would be one that is compact, and should supply the chips with a required number of signal and power connections, which have minute capacitance, inductance, and resistance. The package should remove the heat generated by the circuits. Its thermal properties should match well with semiconductor chip to avoid stress-induced cracks and failures. The package should be reliable, and it should cost much less than the chips it carries
(See Table 11.1).
