ABSTRACT
The heat transfer mechanisms and simple techniques for cooling electronic equipment were described in previous chapters. Although a continuous rise in the power dissipation of electronics, accompanied by a reduction in their dimensions, has placed stringent conditions on the required cooling solutions, these simple techniques are still used to cool most electronic devices. However, there have been situations where the cooling requirements can not be satisfied through the conventional techniques such as simple air-cooled heat sinks. The methods described in this chapter have been used to address those situations. Although many of these techniques have been used widely and enough to be considered as conventional methods, we classify all of them as advanced cooling techniques as opposed to the simpler and cheaper air-based cooling techniques.
