ABSTRACT
In addition to enhancing the metallic cleaning ability of SC-1 solutions, we have also investigated the use of a surfactant in our modified SC-1 solution. Although SC-1 inherently removes particles quite effectively, megasonic energy is often applied which dramatically increases particle removal efficiency. This is increasingly important as the dimensional size of semiconductor devices continues to decrease to even smaller sizes. With this mind, the addition of surfactants to SC-1 will become an important component to prevent particles removed from the wafer surface from re-deposition, thus increasing the particle removal efficiency for small particles.
