ABSTRACT
RCA clean has been a traditional solution for semiconductor wafer aqueous clean ing for decades. It consists generally of SCI (a mixture of Dl water, NH4OH and H2O2) for particle cleaning, SC2 (a mixture of Dl water, HC1 and H20 2) for metal cleaning, HF for silicon dioxide (Si02) etching, and SPM (sulfuric acid and hy drogen peroxide mixture) or SOM (sulfuric acid and ozone mixture) for photore sist stripping.
