ABSTRACT
This chapter discusses packaging materials, packaging processes for microsystems and their applications, as well as impacts on the environment. Chip-scale packages is a technology in which the size of package is the same or slightly larger than that of the chip. In micro-electromechanical system (MEMS) packaging, delicate chips or actuators must directly contact with the working media, which are often very harmful to chips. In many cases, inert gases or vacuums are required inside the MEMS packaging. The main problems faced by optoelectronics packaging are the mismatch between the high digital signal transmission speed and the low optical signal conversion rate, as well as the integration of optical functional components. Photoelectronics packaging performs three functions–providing mechanical holding, enhancing environmental tolerance, and providing electrical connections with other components. Electronics packaging experienced unprecedented changes in the 1990s. Packaging technologies are facing not only challenges but also great opportunities for further development.
