ABSTRACT
This chapter examines the basic design techniques, including electrical design, thermal management design, mechanical design, high-frequency design, microfluidicdesign, and multidiscipinary design. Design is one of the key technologies in microsystems packaging, similar to manufacturing, test, and failure analysis. A successful electrical design for microsystems packaging means that electrical performances, including electrical signals and power flow, can satisfy the whole system requirement after packaging. Microfluidic design focuses on fluidic problems in the microsystem packaging, such as the design of the microchannel network for the analytical operations in the biochip and the design of the fuel chamber and the nozzle in the microthruster. The challenge of multidisciplinary design always exists in the microsystem. With the progress of micro-electro-mechanical system technology, integration of miniaturized thermoelectric cooler and microsystem chips is close to being realized. The eventual buildup of a software specialized for the development of microsystems based on advanced system-level packaging shall lay firm groundwork for the microsystem flourishing.
