ABSTRACT
This chapter gives an overview of low-temperature bonding methods based on surface modification technologies. It is important to decrease the process temperature to around room temperature for application-oriented discrete system packaging, which requires three-dimensional interconnections between diverse substrates. It is critical for the contacting surface to have a well-modified chemical structure and topography for high bond quality at such low temperatures. This chapter focuses on surface modification methods induced by the beam irradiation process, and in it, the technical background, principles, important bondability factors, applications, and future tasks are described.
