ABSTRACT

For possible waste heat applications, there is a large incentive to develop thermoelectric materials that can function at high temperatures. Boron cluster compounds are attractive as materials because of their excellent stability under high temperatures (typical melting points >2000°C) and “unfriendly” (e.g., acidic, corrosive) conditions. Importantly, they have also been found to typically possess intrinsic low thermal conductivity [1-4].