ABSTRACT
Polyimide (PI) films are widely used in the microelectronics industry as intermetal dielectrics, thin film substrates, and protective layers. They possess several attractive features including high-temperature stability, a low dielectric constant, and excellent planarizing characteristics. Film adhesion and reliability, however, continue to be an important area of concern. The purpose of this work was to examine the feasibility of using a surface acoustic wave (SAW) sensor to study the adhesion of PI films nondestructively.
