ABSTRACT
Bismaleimides (BMis) are thermosetting polyimides and polymerize via multiple carbon-carbon bond formation without generating volatile products [1]. The thermal curing behaviour of bismaleimides is similar to epoxy resins and the resultant cured resins have superior thermal properties vis-a-vis epoxy resins. In fact, improvement in thermo-mechanical properties of epoxy resins was observed upon introduction of bismaleimide resins into it [2]. In recent years, there has been a rapid development in the area of bismaleimides owing to their attractive properties and application potentials [ 1, 3-8]. The wide spectrum of their applications includes multilayer printed circuit boards for large-scale computers, encapsulation resins and passivation layers for integrated circuit dies, and structural adhesives [9]. These have also attracted considerable attention as a matrix resin for high-performance composites used in military aircrafts and engines [10-12].
