ABSTRACT
Epoxy and bismaleimide (BMI) resins are two of the major thermosetting resins for matrices of advanced composite materials used in aerospace, transport and electronics industries [1]. Generally, epoxy resins are known to have high tensile strength and modulus, low shrinkage during cure, high adhesion properties, and good chemical and corrosion resistance. The above-mentioned properties, as well as easy modification and processing convenience, result in a wide application of epoxy resins. However, epoxy resins usually do not sustain under high processing temperatures and are not inherently flame retardant [2, 3]. The mechanical properties of epoxy resins are not as good as those of polyimides. On the other hand, in spite of the fact that polybismaleimides are very thermally stable and flame retardant, BMI resins usually suffer from drawbacks of poor processibility, brittleness and high cost. Therefore, to develop novel thermosetting resins combining the ad-
vantages of these two resins to meet the requirements of materials for advanced electronics and other industries is very attractive.
