ABSTRACT
Tin-silver solders are used for high-temperature, high-reliability interconnect applications. Solder joints using Sn-Ag alloys maintain better high-temperature strength than Sn-Pb solders. The design of industrial processes requires reliable thermodynamic data. CALPHAD (Computer Coupling of Phase Diagrams and Thermochemistry) aims to promote computational thermodynamics through the development of models to represent thermodynamic properties for various phases that permit prediction of properties of multicomponent systems from those of binary and ternary subsystems, critical assessment of data and their incorporation into self-consistent databases, development of software to optimize and derive thermodynamic parameters, and the development and use of databanks for calculations to improve our understanding of various industrial and technological processes.
