ABSTRACT
In previous chapters, we have discussed forced air convective heat transfer from simple planar surfaces and modules on printed circuit boards. The present chapter will show you how to calculate forced convective heat transfer from extended surfaces, i.e., plate fin heat sinks (usually in the form of an extrusion) and pin fin arrays. You will learn about some correlations that the author has successfully used to make temperature predictions. Where available, you will also see comparison of some calculated results with test data.
