ABSTRACT
Integrated circuit (IC) andmicroelectromechanical systems (MEMS)
fabrication must be carried out in specially constructed clean rooms
where particles per cubic meter and their sizes in the air are held to
a very low level. This is to avoid contamination of the MEMS wafers
and devices during fabrication as air-borne particles are generally
bigger than the smallest MEMS features and can cause fabrication
errors and low yield.
