ABSTRACT
In early and mid-2000, ideas that emerged from the Power Electronics Building Block (PEBB) and Advanced Electrical Power Systems (AEPS) programs were assimilated by large power semiconductor manufacturers and designed-into the development of Intelligent Power Modules. Most power converter products are already well defined and accepted by many customers. Similar advancements were possible within the collateral efforts of the power semiconductor manufacturers. Power modules can be designed with or without a base-plate. The heat removal performance is obviously related to the performance of the materials used for packaging of the power modules. The power electronics designer can therefore focus on performance achievements at system or power circuitry level. The two major programs including both academia and industry were the PEBB and later the AEPS. The heat removal performance is obviously related to the performance of the materials used for packaging of the power modules.
