ABSTRACT
New applications in the electronics industry, with major emphasis on miniaturization and increasing power of electronic devices, require materials which are good conductors of heat so that the heat generated in the devices is dissipated away as quickly as possible in order to maintain the temperature of the device at the desired level. To that end, polymer-matrix composites (PMCs) consisting of highly thermally conductive filler are considered to be good candidates. The heat conducting ability of the plastic material (polymer) is enhanced greatly by dispersing thermally conductive filler in the polymer matrix.
