ABSTRACT
Thin lms are extensively used in microelectromechanical systems (MEMS). Different types of dissimilar material interfaces are encountered in contemporary MEMS structures, including metal-metal, metal-ceramic, polymer-metal, and polymer-ceramic interfaces. The toughness of the material interface is important if the semiconductor devices are to operate reliably; adhesion failures are major obstacle in bringing new devices to market and achieving full capability [1-3]. Accordingly, interfacial delamination issue in MEMS continues to pose signicant challenges to both design and process engineers.
