ABSTRACT
Deposition is one of the main fabrication tools used in microelectromechanical system (MEMS) fabrication to deposit thin films of materials. MEMS deposition technology can be categorized into two ways. The first one is responsible for chemical reaction, that is chemical vapour deposition, electrodeposition, and epitaxial growth. The second deposition process is due to physical reaction, that is physical vapour deposition. A very good quality of surface morphology of the deposited film has been observed while using vacuum processes. The properties of deposited thin films can be measured by in situ monitoring technique. The problem associated with chemical deposition technique of the film is erratic, and the thickness is non-uniform. The main advantage of vacuum is the formation of the conformal coating ranging from several nanometres to more than 100 mm with high quality and superb repeatability of coating property. Sequential as well as co-deposition of thin films is possible with thermal evaporation technique.
