ABSTRACT
The adhesive must be flexible enough to accommodate thermal stresses from joined materials having different coefficients of thermal expansion. Removal of the bonded heat sink without damage to components is a difficult requirement because the greater the surface area of a heat sink, the more difficult it is to remove. Therefore, the adhesive needed to be very soft and low in modulus. The material would as a thermally conductive path for electronic components to transfer heat to a metallic heat sink. Rick needed the best thermal conduction possible while meeting the other requirements. The technical problem is to bond a heat sink to a printed wiring assembly using an adhesive which is a dielectric as well as a thermally conductive material.
