ABSTRACT
During the process of doing formulation development work for Delco Electronics Corporation, Steve Lau and the author discovers that the Flexipoxy formulations could be made into room temperature-stable compounds, which would adequately cure at low enough temperatures for electronic assembly purposes. In 1992, Steve Lau and the author were granted modest funding from our division to research and develop one-component, room temperature-stable, flex-ible epoxy compounds, and seek to patent them. One-component epoxy compounds, stable at room temperature, already existing for hard, rigid epoxies. The approach For Developing The 1c-Rts-Fe General-Purpose Adhesive was to combine different flexible epoxy resins with latent curatives and determine if they are compatible, cure within an hour at temperature under 140°C, and are flexible once cured. The trick is to find combination of flexible epoxy resin and latent curative, which not only cures properly but has maximized liquidity uncured.
