ABSTRACT
This chapter considers the spin-off potential of the material. These electronic assembly materials were developed for very high-volume implementation in automotive electronics manufacturing. Electronic circuit assemblies often must survive under hostile operating conditions. Delco Electronics engineers required A Solder joint lead encapsulants (SJLE) which cured at lower temperatures than the 150°C required by commercially available SJLEs. The chapter suggests that separate patents exist to give patent rights to both Delco Electronics and Hughes Aircraft companies. Customized SJLEs to match different manufacturing conditions are possible using the formulating technology discussed in these patents. The chapter examines the 2014 Huntsman product bulletin for Jeffamine polyether amines and noticed several other diamines which might yield interesting candidates for reactive hot melt development. The concept of an adhesive, encapsulant, sealant, or coating which can be applied as a hot melt material for rapid processing and which converts to an insoluble, non-melting, rigid thermoset during subsequent thermal excursions applies to a multitude of applications.
