ABSTRACT
This chapter shows what effect the physico-technical process parameters have on the strength of adhesion between metal films and the surfaces of dielectric substrates. The adhesion of a metal film to a substrate surface treated with an ion–electron flux is a function of the irradiation time tir, the discharge current I, and the accelerating voltage U. The ion–electron bombardment of a Me–Sub structure with the missing intermediate layer of organic contaminants, according to the mechanism proposed, results in the complete activation of metal–dielectric surface bonds at the interface. The structures under analysis were bombarded with an ion–electron flux generated by a high-voltage gas discharge outside the electrode gap. The chapter concludes that bombarding the surface of the metal–organic contamination–substrate structure with an ion–electron flux is conducive to an active dissociation of hydrocarbon molecules.
