ABSTRACT
The assessment of the HIGHTECS prototype parts has covered the following components: ASIC in PGA Package; Hybrid Circuit; High Temperature PCB for resistors; and HIGHTECS Module. The HIGHTECS ASIC as designed has been also shown to function through to the generation of the dual output ARINC 429 data. The characterisation printed circuit board for the HIGHTECS ASIC has been designed and manufactured. The FPGA board has been connected to the characterisation board containing the HIGHTECS ASIC in PGA package and the characterisation board has been placed into either an oven for high temperature testing up to 275°C or a chamber for testing down to -40°C. Environmental tests have been performed throughout the HIGHTECS project on a SOI test chip fabricated using the same semiconductor process in the manufacture of the HIGHTECS ASIC. High temperature storage tests have been carried out on selected HIGHTECS ASICs assembled in PGA packages.
