ABSTRACT
Based on the temperature profiles supplied by Turbomeca, estimates of the operating lifetime expected by extrapolating results from temperature storage tests at 200°C and 250°C for 1000 hours have been made. A preliminary FMEA has been carried out based on the functional block description of the design of the HIGHTECS module containing the HIGHTECS hybrid circuit and a high temperature pcb containing resistors. The actual dimensions of the prototype HIGHTECS module exceed the target dimensions, mainly on the length and width due to the currently available high temperature connectors. If miniature high temperature connectors are developed, there is scope for size reduction. Internally, the derated resistors for high temperature operation have the largest dimensions. As miniaturised high temperature resistors become more widely available, these resistors could be incorporated in the hybrid circuit. The discontinuities reduce as the analogue supply voltage is increased above the digital supply voltage and as the temperature is increased above ambient.
