ABSTRACT
This chapter demonstrates the capabilities for designing, manufacturing and testing an application specific semiconductor device based on SOI process technology for application in high temperature aero-engine control. Alternative semiconductor materials and processes are being developed for high temperature applications, such as SiC and GaN, but the process complexity is restricted and further developments will be required to reach the current capability of the high temperature SOI process. In parallel to the development of semiconductors for high temperature applications, advances have been made in extending the capabilities of passive components, such as capacitors, resistors and inductors. High temperature devices and components are normally supplied with a standard metallisation, based on the accepted practices of the manufacturer. Alongside the specific devices and components for high temperature aeroengine control systems, protection against transients caused by EMI and lightning strikes must be catered for.
