ABSTRACT
The advent of 5G advanced and transition to 6G wireless systems are ushering in a new era of challenges for radio frequency (RF) front-end module design and integration. To seamlessly navigate this technological shift, which incorporates new sub-20-GHz spectrum (FR3) allocation and the expanded utilization of millimeter-wave frequencies (FR2), the foundational RF technology substrate must be engineered to meet the stringent performance demands of next-generation 5G advanced and 6G RF front-ends. This evolution requires cutting-edge semiconductor technologies to optimize signal integrity, power efficiency, and system integration. In our forthcoming discussion, we will present RF substrate technology roadmap, crucial for architecting the resilient, high-performance RF systems that will underpin the next-generation 5G and 6G wireless infrastructure.
In this paper, we will provide a roadmap of RF technology including the engineered substrates enabling to solve design challenges of wireless communication systems.
