ABSTRACT
This conclusion presents some closing thoughts on the concepts discussed in the preceding chapters of this book. The book discusses one of the upcoming NoC architectures is three-dimensional (3D) network-on-chip (NoC). The NoC layers grow vertically with reduced communication overhead. The other directions, which are in progress, include the following: photonic NoC and wireless NoC. Photonic communication can provide large data transfers with minimal power consumption. Photonic NoC provides the two advantages: Multiple terabits per second communication on a single waveguide with limited power dissipation and Power consumption that is independent of the link length and scales only with link transmission interface circuitry, such as modulators, drivers, and receivers. The wireless communication alleviates the latency and energy dissipation issues of conventional technologies, and also solves the complex interconnect routing and placement problems. Multihop communication of traditional technologies can be converted into a single hop, resulting in significant saving in delay for communication.
