ABSTRACT
This chapter gives a brief description of a light-emitting diode and describes the unique packaging requirements of light-emitting diodes and their similarities to semiconductor assembly and packaging. light-emitting diode (LEDs) can generate more illumination per watt than incandescent bulbs, which is favorable for battery-powered or energy-saving devices. LEDs are adversely affected by elevated temperatures, and operating one in an overheated ambient environment for a prolonged period of time may result in overheating, which could lead to premature failure of the device. LED chips are made from compound semiconductor materials that tend to be brittle and expensive as compared to silicon. LED packaging also requires the device/package structure to allow the maximum amount of light to exit in the pattern desired. Sometimes that may mean the LED chip sits within a highly reflective cavity, usually of a white color. Some products require multiple LED chips packaged together in one unit, often of different colors.
