ABSTRACT
This chapter looks at electronic packaging needs for specialized functions and devices, as well as specialized semiconductor technologies. Tape automated bonding is an alternate method to wire bonding for creating interconnections from chip to lead frame or substrate. Micro Electro-Mechanical Systems devices are packaged in a large variety of ways due to the great variation in requirements. These requirements, and the resulting package solutions, go beyond those imposed on semiconductor packaging and result in an unusual variety of packages. An image sensor package is an optical element, whether based on a complementary metal oxide semiconductor or charge coupled device packaged with an optical lens that enables the imaging functions. The advent of the digital still camera brought about the initial growth and demand for compact, removable memory cards. The continued expansion of solar power and the changes anticipated in solar cell technology and operational demands will eventually move to more stringent requirements.
