ABSTRACT
The ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package but it offers enhanced solder joint fatigue reliability through a compliant solder column [1]. The specimen was a CCGA package assembled to a FR-4 printed circuit board (PCB). The CCGA package was a 44 mm square module with 1089 I/O interconnections (33 by 33). A specimen with a strip array configuration was prepared from the assembly, containing four central rows of solder columns. A schematic diagram of the CCGA assembly after reflow is shown in figure 4.3.1 with relevant dimensions. The assembly contained cast-in-place columns, where wire solder columns were cast directly on the ceramic substrate and subsequently connected to a PCB using eutectic solder. The wire solder column is made of a high melting point solder alloy (90%Pb/10%Sn). The wire column does not reflow during the assembly process, which provides a consistent and reproducible standoff between the ceramic package and the PCB. One side of the specimen was ground flat to expose the largest cross section of solder columns for specimen grating replication. Schematic diagram of the CCGA package assembly after reflow. https://s3-euw1-ap-pe-df-pch-content-public-p.s3.eu-west-1.amazonaws.com/9780429142765/bd523e32-3998-41a2-8515-f7d9c197908c/content/fig4_3_1.tif"/>
