ABSTRACT

Electrodepostion as a means of filling vias and trenches has been developed since the mid 1990’s as part of the copper damascene process for back end of line (BEOL) wiring so the first section compares in general the TSV and Cu-Damacene filling applications. Electro-filling is a fascinating technology that encompasses diffusion, adsorption, and chemical reaction mechanisms, which have been studied for 15 years as applied to CuDamascene applications and are only recently being studied with respect to TSV applications, the next section describes the primary Cu-Damascene filling models. The third section reviews some of the literature on TSV filling and discusses how the Cu-Damascene models may be extended to TSV geometries.